SK hynix is reportedly exploring cooperation with Intel in advanced 2.5D packaging, a move that could signal potential shifts in the AI chip packaging supply chain. According to ZDNet, sources say SK ...

The news is coming from TheElec, with their sources saying Samsung's Advanced Package (AVP) team will be providing an interposer and I-Cube -- its 2.5D package -- to NVIDIA. Other companies will ...

Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding the timetable for ...

As AI models, autonomous driving, and HPC explode, traditional packaging can't meet higher computing density and efficiency demands. TSMC's CoWoS (Chip-on-Wafer-on-Substrate) technology—integrating ...

TSMC's tight CoWoS supply is reportedly pushing SK Hynix to work with Intel on advanced packaging, as the industry looks to diversify the 2.5D packaging supply chain for AI accelerators. Some ...

HANMI Semiconductor said on the 4th that it will participate in the "2026 Semicon Southeast Asia" exhibition and introduce its new equipment scheduled for release this year, the "2.5D TC Bonder 40" ...

Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

Multi-protocol subsystem IP provides 8 Tbps/mm bandwidth density with D2D data rate of 24 Gbps for hyperscaler, high performance computing (HPC) and AI applications LONDON & TORONTO--(BUSINESS ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...