Intel’s EMIB-T packaging gains traction as Google expands its TPU supply chain with new Taiwanese partners and growing AI ...

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

TrendForce’s latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC’s ...

Generative AI adoption in the U.S. has reached 53%, the fastest uptake of a general-purpose technology in modern history, creating unprecedented demand for AI hardware. This surge is straining ...

Intel has showcased new chip packaging technologies, including a combination of Embedded Multi-die Interconnect Bridge (EMIB) and Foveros on a single chip and a new interconnect technology it dubs ...

Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain by leveraging one of the few areas where it still holds a differentiated ...

MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

Intel’s EMIB was the foundation of the Kaby Lake-G partnership with AMD. Intel’s Foveros stacked-die technology produced the upcoming Lakefield chip. Now Intel is combining EMIB and Foveros into what ...

Most chips in today’s smartphones, computers and servers are comprised of multiple smaller chips invisibly sealed inside one rectangular package. How do these multiple chips — often including CPU, ...

Intel has showcased new chip packaging technologies, including a combination of Embedded Multi-die Interconnect Bridge (EMIB) and Foveros on a single chip and a new interconnect technology it dubs ...