Intel has confirmed that it’s working on a discrete graphics solution for “client PCs,” which will arrive in 2020. That, however, is far from all Intel is working on. The company laid out its ...

Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...

Intel made a series of major announcements this week, unveiling a suite of new technologies to power PCs and other smart devices. On Tuesday (11 December), Intel’s Architecture Day was the backdrop ...

Add Yahoo as a preferred source to see more of our stories on Google. Intel Foveros isn’t the name of a new chip, but rather a technology that will allow the chipmaker to bundle various vertical chip ...

"Hot Chips" sounds like a nice side dish, but is in fact a technological symposium held yearly in Silicon Valley. It's a place for processor vendors to talk about their latest innovations, and while ...

Intel’s EMIB was the foundation of the Kaby Lake-G partnership with AMD. Intel’s Foveros stacked-die technology produced the upcoming Lakefield chip. Now Intel is combining EMIB and Foveros into what ...

Intel will invest $3.5 billion in its Rio Rancho fab to support Foveros, its 3D manufacturing and packaging technology. The site in New Mexico is currently used to manufacture Optane memory and ...

The big picture: Intel shared several next-gen technologies at its recent Architecture Day but Foveros 3D stacking may hold the most long-term promise. Its impact will all depend on how many product ...

After years of setbacks, Intel Corp. today finally debuted Sunny Cove, the 10-nanometer chip architecture that will power its next generation of computer processors. But surprisingly, the ...

Intel has announced its first 'Lakefield' hybrid CPUs to make use of its Foveros 3D chip stacking technology. The Core i5-15G7 and Core i3-13G4 are 7W 'Sunny Cove' parts that use a 10nm manufacturing ...