The proposed Intel-3DGS glass substrate facility will not make chips, but it could help India secure a place in the supply ...

Intel Corporation and 3D Glass Solutions have signed an MoU with the Odisha government to explore setting up an advanced ...

Intel Corporation and Arizona-based 3D Glass Solutions (3DGS) are exploring a $3.3-billion investment in Odisha to set up India’s first advanced semiconductor glass core packaging substrate ...

One of the largest high-technology manufacturing investments in India, the project builds on the efforts under the India ...

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

Intel plans to build a semiconductor substrate manufacturing facility in India. The company is partnering with 3D Glass ...

Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of ...

Intel (NasdaqGS:INTC) and 3DGS plan a new substrate manufacturing plant in India with a reported investment of US$3.3b. The ...

By Wen-Yee Lee TAIPEI, May 29 (Reuters) - Taiwan chip designer MediaTek said on Friday it supports both TSMC's and Intel's ...

Odisha has secured a proposed $3.3 billion semiconductor substrate project involving Intel Corporation and 3D Glass Solutions Inc., marking one of the largest high-technology manufacturing commitments ...

Intel signs pact with Odisha & 3DGS to bring semiconductor substrate manufacturing tech to India. $3.3B investment, 1800+ ...

Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data center sectors.