A new technical paper titled “MegaMmap: Blurring the Boundary Between Memory and Storage for Data-Intensive Workloads” was ...

A new technical paper titled “Spiking Transformer Hardware Accelerators in 3D Integration” was published by researchers at UC ...

A new technical paper titled “Dual-Layer Thin-Film Transistor Analysis and Design” was published by researchers at Oregon ...

Why AI inference is happening on the CPU, the different technological approaches for AI inference, and examples of AI ...

Overcoming the many multi-die design challenges and improve productivity with optimized performance and system power.

Enabling Authenticated Encryption Testing in Systems-in-Package” was published by researchers at University of Florida and ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased ...

Parallel test is used for nearly every device produced by fabs and OSATs, but it can reduce yield and increase the cost of ...

A hardware-software contract is needed for software portability, but RISC-V is not yet defined well enough to know what that ...

Both AI and ML have already been deployed in advanced testing for complex systems and packages to track the number of test ...

proteanTecs AVS Pro has demonstrated the potential to extend chip lifespans by up to 18%. In data centers, this translates to ...

Creating a successful digital twin relies on asking the right questions and knowing what problem you're trying to solve.