Process Innovations for Future Technology Nodes with Back-Side Power Delivery and 3D Device Stacking
Abstract: The recent report of a high-yielding process with Back-Side Power Delivery (BSPD) using PowerVia, the benefits obtained on an Intel E-core implementation, and the imminent deployment of ...
Dimensions (mm) 310.30 x 214.70 x 11.90 318.00 x 230.00 x 15.20 ...
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