VeroTherm™ and VeroFlex™ Systems by YES. These systems will enable 3D stacking of memory and logic chips for high-performance AI accelerators, driven by large language model (LLM) applications.
MediaTek is negotiating production of certain chips in the U.S. with TSMC in a bid to meet customer requirements for locally manufactured components. While the plan is still under evaluation, if ...
PROCESS IMPROVEMENT TOOLS AND METHODS AI holds transformative potential across Army operations—from logistics and maintenance to intelligence and cybersecurity—but its success depends on first ...
CoNi-HESA superalloy shows exceptional performance in 3D printing, combining strength and ductility for high-temperature applications with minimized defects.
Pilot study met key 3-month efficacy endpoint with strong statistical significance (p=0.014); Revita-treated patients lost an additional 2.5% ...
With the widespread application of technologies such as high-throughput sequencing, large-scale clinical trials, and complex computational ...
Learn how AI is transforming the software development lifecycle and driving innovation. Discover the benefits of integrating AI into your organization's processes.
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