Siemens Digital Industries Software announced has expanded the cloud platforms of choice available for systems-of-systems ...

A TSMC and Intel joint-venture, ST's SiC fab in China, the latest news from Embedded World 2025, TI's smallest MCU, and the ...

SEEQC of  New York has installed a Cross-Qubit Scaling Platform at the National Quantum Computing Centre (NQCC) in ...

The UK Space Agency (UKSA) is boasting a record six months for contract wins involving the European Space Agency (ESA).

Rapidus, which is due to produce its first prototype chips next month, has come under fire from politicians in Japan, reports ...

JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test.