Fusion Fuel Cycles has reached an agreement with California-based General Atomics to finalise a USD20 million, ten-year strategic investment into the Unique Integrated Testing Facility (UNITY-2) ...

When you’ve played video games long enough, you eventually develop something of a “Spidey Sense” when you see a game that seems like it’s going to be extra special. You never know until the final ...

When you’ve played video games long enough, you eventually develop something of a “Spidey Sense” when you see a game that seems like it’s going to be extra special. You never know until the final ...

Sonic Mania is one of the best Sonic games ever, and while there were hopes it would get a sequel, a few years ago, it was revealed how Sega was eager to move beyond pixel art and ultimately it didn't ...

Unity Software Inc. reported stronger-than-expected financial results for Q2 2025, with both earnings per share (EPS) and revenue surpassing analyst forecasts. The company posted an EPS of $0.18, ...

A new technical paper titled “System-Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution” was published by researchers at Intel Corporation. “The ...

It looks like the next God of War game will go back to its Greek roots. Not only that, it'll ditch the current over-the-shoulder action perspective moving to a 2.5D Metroidvania style of gameplay that ...

2.5D platformers offer a unique combination of 2D gameplay in a 3D space. Some of the best games in the genre incorporate the 2.5D perspective into gameplay, with hazards striking from the background.

One of the most amazing things that human civilization has created is the silicon chip, with semiconductor technology not just about the 'CPU' or the 'GPU' anymore... but rather advanced packaging ...

Governments and humanitarian organizations need reliable data on building and infrastructure changes over time to manage urbanization, allocate resources, and respond to crises. However, many regions ...

Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...