IEEE

Redistribution Layer Routing for Fan-Out Wafer-Level Packaging Considering Multiple Advanced Design Rules

Abstract: Advanced fan-out wafer-level packaging (FOWLP) has become a key enabler for high-performance computing (HPC) and artificial intelligence (AI) systems, offering high-density and heterogeneous ...
IEEE

Co-Design and ML-Based Optimization of Through-Via in Silicon and Glass Interposers for Electronic Packaging Applications

Abstract: Copper-filled via is a critical component of advanced electronic packaging technologies. Embedded in interposer substrate, vias provide enhanced electrical performance in 2.5-D and 3-D ...
insurancebusinessmag

Bank Negara Malaysia clarifies rules on medical insurance co-payment

Bank Negara Malaysia (BNM) has identified the circulation of inaccurate information on social media by certain registered agents of insurers/takaful operators (ITOs) and financial advisers’ ...
Page Six

‘Vanderpump Rules’ alums Tom Sandoval, Ariana Madix quietly sell former love nest after messy split

Ariana Madix and Tom Sandoval quietly sold their formerly shared LA home three years after their messy breakup. Sources claim the couple was able to sell the Valley Village farmhouse for $3.1 million ...