AeroFlexx, an industry leader in sustainable liquid packaging, today announced a comprehensive partnership with Dreiturm GmbH ...

TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the ...

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

“Spec to Pack” links packaging specifications, workflows and production data across packaging life cycle in one digital ...

New venture arm to invest in and scale companies driving the next generation of packaging and reimagining how products move through the global supply chain.

Packaging is more than a product vessel. It serves as a strategic tool for storytelling, trust-building, and delivering immersive brand experiences. Retailers and brands that leverage packaging as a ...

ASX is posting record ATM revenue and raising its LEAP outlook above $3.5B, as advanced packaging demand climbs with AI infrastructure.

MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

ASE Technology Holding Co., Ltd. ASX is benefiting from a favorable semiconductor industry backdrop, driven by surging artificial intelligence (AI) adoption, growing high-performance computing (HPC) ...

Transit packaging has come of age. Booming internet sales have supercharged the use of transit packaging, making it a focal ...

WEST LAFAYETTE, Ind. – A large-scale manufacturing process to improve food packaging and keep groceries fresher longer has received top honors at one of the world’s largest technical conferences for ...

Gain Real-World Experience: Two blocks of cooperative education provide you with hands-on, full-time paid work experience in the packaging science industry ...